Project Overview
This project focused on functionalizing diamond as a superior thermal heat spreader for high-powered chips. The primary goal is to successfully increase the adhesion between diamond and thin metal films by addressing the existing coefficient of thermal expansion mismatch of the two materials.
The Challenge
Work in Progress
Experiment Setup
Work in Progress
- Work in Progress
- Work in Progress
- Work in Porgress
Experiment Results
Work in Progress
← Back to Portfolio